Logo - springer
Slogan - springer

Materials - Nanotechnology | Force Sensors for Microelectronic Packaging Applications

Force Sensors for Microelectronic Packaging Applications

Schwizer, Jürg, Mayer, Michael, Brand, Oliver

2005, VIII, 178 p.

Available Formats:
eBook
Information

Springer eBooks may be purchased by end-customers only and are sold without copy protection (DRM free). Instead, all eBooks include personalized watermarks. This means you can read the Springer eBooks across numerous devices such as Laptops, eReaders, and tablets.

You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal.

After the purchase you can directly download the eBook file or read it online in our Springer eBook Reader. Furthermore your eBook will be stored in your MySpringer account. So you can always re-download your eBooks.

 
$159.00

(net) price for USA

ISBN 978-3-540-26945-8

digitally watermarked, no DRM

Included Format: PDF

download immediately after purchase


learn more about Springer eBooks

add to marked items

Hardcover
Information

Hardcover version

You can pay for Springer Books with Visa, Mastercard, American Express or Paypal.

Standard shipping is free of charge for individual customers.

 
$209.00

(net) price for USA

ISBN 978-3-540-22187-6

free shipping for individuals worldwide

usually dispatched within 3 to 5 business days


add to marked items

Softcover
Information

Softcover (also known as softback) version.

You can pay for Springer Books with Visa, Mastercard, American Express or Paypal.

Standard shipping is free of charge for individual customers.

 
$209.00

(net) price for USA

ISBN 978-3-642-06063-2

free shipping for individuals worldwide

usually dispatched within 3 to 5 business days


add to marked items

  • About this book

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Content Level » Research

Keywords » Flip-chip - Force sensor - Piezoresistivity - Process monitoring - Semiconductor - Sensor - Technologie - Wire bonding - design - development - interconnect - reliability - technology

Related subjects » Electronics & Electrical Engineering - Engineering - Nanotechnology - Optical & Electronic Materials - Production & Process Engineering

Table of contents 

Popular Content within this publication 

 

Articles

Read this Book on Springerlink

Services for this book

New Book Alert

Get alerted on new Springer publications in the subject area of Nanotechnology.