Nanopackaging

1. Front Matter

   Pages i-xxi

   PDF

2. Nanopackaging: Nanotechnologies and Electronics Packaging

   • James E. Morris

   Pages 1-14

3. Modelling Technologies and Applications

   • C. Bailey, H. Lu, S. Stoyanov, T. Tilford, X. Xue, M. Alam et al.

   Pages 15-38

4. Application of Molecular Dynamics Simulation in Electronic Packaging

   • Haibo Fan, Matthew M. F. Yuen

   Pages 39-59

5. Advances in Delamination Modeling

   • O. van der Sluis, C. A. Yuan, W. D. van Driel, G. Q. Zhang

   Pages 61-91

6. Nanoparticle Properties

   • James E. Morris

   Pages 93-107

7. Nanoparticle Fabrication

   • Y. Hayashi, M. Inoue, H. Takizawa, K. Suganuma

   Pages 109-120

8. Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges

   • Jiongxin Lu, C. P. Wong

   Pages 121-137

9. Nanostructured Resistor Materials

   • Fan Wu, James E. Morris

   Pages 139-162

10. Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging

    • Gopal C. Jha, Swapan K. Bhattacharya, Rao R. Tummala

    Pages 163-188

11. Nanoconductive Adhesives

    • Daoqiang Daniel Lu, Yi Grace Li, C.-P. Wong

    Pages 189-208

12. Nanoparticles in Microvias

    • Rabindra N. Das, Frank D. Egitto

    Pages 209-237

13. Materials and Technology for Conductive Microstructures

    • Jan Felba, Helmut Schaefer

    Pages 239-263

14. A Study of Nanoparticles in SnAg-Based Lead-Free Solders

    • Masazumi Amagai

    Pages 265-285

15. Nano-Underfills for Fine-Pitch Electronics

    • Pradeep Lall, Saiful Islam, Guoyun Tian, Jeff Suhling, Darshan Shinde

    Pages 287-323

16. Carbon Nanotubes: Synthesis and Characterization

    • Yamini Yadav, Vindhya Kunduru, Shalini Prasad

    Pages 325-344

17. Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications

    • Vindhya Kunduru, Yamini Yadav, Shalini Prasad

    Pages 345-375

18. Carbon Nanotubes for Thermal Management of Microsystems

    • Johan Liu, Teng Wang

    Pages 377-393

19. Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes

    • Wood-Hi Cheng, Chia-Ming Chang, Jin-Chen Chiu

    Pages 395-413

20. Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes

    • K. Mohan Kumar, V. Kripesh, Andrew A. O. Tay

    Pages 415-440

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

• Nanotube
• carbon nanotubes
• nano-silica filler
• nanocomposite resistors
• nanoelectronic
• nanomaterials
• nanoparticles
• nanotechnology

From the reviews: “This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. … I am pleased to be able to conclude this … Nanopackaging: Nanotechnologies and Electronics Packaging as ‘highly recommended’.” (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)

• Dept. Electrical &, Computer Engineering, Portland State University, Portland, USA

  James E. Morris

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