Editors

Editor-in-Chief

Gwo-Bin Vincent Lee
National Tsing Hua University
Department of Power Mechanical Engineering
Taiwan
e-mail: gwobin@pme.nthu.edu.tw

Associate Editors

Stéphane Colin
Institut Clément Ader
Université de Toulouse
France
e-mail: colin@insa-toulouse.fr

Marie-Caroline Jullien
Institut de Physique de Rennes 
CEDEX
France
e-mail: marie-caroline.jullien@univ-rennes1.fr 

Qiao Lin
Columbia University
Department of Mechanical Engineering
New York, NY
USA
e-mail: qlin@columbia.edu

Che-Hsin Lin
National Sun Yat-Sen University
Department of Mechanical and Electro-mechanical Engineering
Taiwan
e-mail: chehsin@mail.nsysu.edu.tw
 
Hywel Morgan
University of Southampton
ECS, Faculty of Physical Sciences and Engineering
United Kingdom
e-mail: hm@ecs.soton.ac.uk

Nam-Trung Nguyen
Griffith University
QLD Micro- and Nanotechnology Centre
Australia
e-mail: nam-trung.nguyen@griffith.edu.au

Sumita Pennathur
University of California, Santa Barbara
College of Engineering
USA
e-mail: sumita@ucsb.edu

Shaurya Prakash
Ohio State University
Department of Mechanical & Aerospace Engineering
USA
e-mail: prakash.31@osu.edu

Wei Wang
Peking University
Institute of Microelectronics
P.R. China
e-mail: w.wang@pku.edu.cn 

Pak Kin Wong 
The Pennsylvania State University
USA
e-mail: pxw28@psu.edu


Editorial Advisory Board

Chong H.  Ahn
University of Cincinnati
Microsystems and BioMEMS Lab
Department of Electrical and Computer Engineering
USA

Haim H. Bau
University of Pennsylvania
The Department of Mechanical Engineering and Applied Mechanics
USA

Albert van den Berg
University of Twente
Faculty of Electrical Engineering
The Netherlands

Kenneth Breuer
Brown University
Division of Engineering
USA

Carlo Effenhauser
Roche Instrument Center AG
Microtechnology Center 
Switzerland

Jan C. T. Eijkel
University of Twente
Faculty of Electrical Engineering, Mathematics and Computer Science
The Netherlands

David Erickson
Cornell University
Sibley School of Mechanical and Aerospace Engineering
USA

Richard Fair
Duke University
Department of Electrical and Computer Engineering
USA

Martin Gijs
Swiss Federal Institute of Technology (EPFL)
Institute of Microelectronic & Microsystems (IMM)
Laboratory for Microsystems (LMIS)
Switzerland

Satish G. Kandlikar
Rochester Institute of Technology
Mechanical Engineering Department
USA

Takehiko Kitamori
University of Tokyo 
Department of Applied Chemistry
Japan

Dongqing Li (Founding Editor) 
University of Waterloo
Department of Mechanical and Mechatronics Engineering
Faculty of Engineering 
Canada

Gui-Rong Liu
University of Cincinnati
Department of Aerospace Engineering &
Engineering Mechanics
USA

Juan G. Santiago
Stanford University
Department of Mechanical Engineering
USA

Shuichi Takayama
Georgia Institute of Technology & Emory University School of Medicine
Wallace H. Coulter Department of Biomedical Engineering
USA

Joseph Wang
Arizona State University
Department of Chemical & Materials Engineering
USA

Chun Yang
Nanyang Technological University
Division of Thermal Fluids Engineering
School of Mechanical and Aerospace Engineering
Singapore

Ruey-Jen Yang
National Cheng Kung University
Department of Engineering Science
Taiwan

Roland Zengerle
University of Freiburg
Dept. of Microsystems Engineering - IMTEK
Germany

Yitshak Zohar
The University of Arizona
Department of Aerospace & Mechanical Engineering
Department of Biomedical Engineering
USA