Overview
- Discusses multiscale modeling of materials at the mesoscale
- Covers atomistic modeling of mechanical properties
- Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties
- Includes supplementary material: sn.pub/extras
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Table of contents(14 chapters)
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Quantum Mechanics and Molecular Methods: Uses for property understanding
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Large scale atomistic methods and scaling methods to understand mechanical failure in metals
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Molecular scale modeling uses for Carbon Nanotube behavior
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Molecular methods to understand mechanical and physical properties
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Multiscale methods and perspectives
About this book
Editors and Affiliations
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Honeywell Specialty Materials, Sunnyvale, USA
Nancy Iwamoto
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, Department of Mechanical Engineering, Hong Kong University of Science and Tech, Kowloon, Hong Kong SAR
Matthew M.F. Yuen
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, Philips Innovation Campus Shanghai, Philips Investment Co. Ltd., Shanghai, China, People's Republic
Haibo Fan
Bibliographic Information
Book Title: Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Editors: Nancy Iwamoto, Matthew M.F. Yuen, Haibo Fan
DOI: https://doi.org/10.1007/978-1-4614-1728-6
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2012
Hardcover ISBN: 978-1-4614-1727-9
Softcover ISBN: 978-1-4899-8837-9
eBook ISBN: 978-1-4614-1728-6
Edition Number: 1
Number of Pages: XII, 260
Topics: Solid Mechanics, Optical and Electronic Materials, Nanoscale Science and Technology