Electron Beam Testing Technology

1. Front Matter

   Pages i-xvi

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2. Background to Electron Beam Testing Technology

   1. Background to Electron Beam Testing Technology

      • William Nixon

      Pages 1-9

3. Part I

   1. Front Matter

      Pages 11-11

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   2. Introduction

      • J. T. L. Thong

      Pages 13-34

   3. Principles and Applications

      • J. T. L. Thong

      Pages 35-125

4. Part II

   1. Front Matter

      Pages 127-127

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   2. Essential Electron Optics

      • A. R. Dinnis

      Pages 129-173

   3. Electron Beam Interaction with Specimen

      • K. Ura

      Pages 175-209

   4. Electron Spectrometers and Voltage Measurements

      • L. Dubbeldam

      Pages 211-239

   5. High-Speed Techniques

      • J. T. L. Thong

      Pages 241-287

   6. Picosecond Photoemission Probing

      • H. Beha, R. Clauberg

      Pages 289-313

   7. Signal and Image Processing

      • F. M. Boland, E. R. Lynch

      Pages 315-358

5. Part III

   1. Front Matter

      Pages 359-359

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   2. System Integration

      • M. Battù, P. Garino, M. Melgara

      Pages 361-395

   3. Practical Considerations in Electron Beam Testing

      • T. J. Aton

      Pages 397-415

   4. Industrial Case Studies

      • D. W. Ranasinghe, I. G. Whyte, J.-P. Collin, G. V. Lukianoff

      Pages 417-444

6. Back Matter

   Pages 445-462

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Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing. While ICs were being fabricated on design rules of several microns, the mechanical ne edle probe served quite adequately for internal chip probing. This scenario changed with growing device complexity and shrinking geometries, prompting IC manufacturers to take note ofthis new testing technology. It required several more years and considerable investment by electron beam tester manufacturers, however, to co me up with user-friendly automated systems that were acceptable to IC test engineers. These intervening years witnessed intense activity in the development of instrumentation, testing techniques, and system automation, as evidenced by the proliferation of technical papers presented at conferences. With the shift of interest toward applications, the technology may now be considered as having come of age.

• Signal
• electron optics
• integrated circuit
• material
• optics
• testing

• Cambridge University, Cambridge, England

  John T. L. Thong

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