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Designing 2D and 3D Network-on-Chip Architectures

  • Book
  • © 2014

Overview

  • Describes essential theory, practice and state-of-the-art applications of 2D and 3D Network-on-Chip interconnect
  • Enables readers to exploit parallelism in processor architecture, with interconnect design that is efficient in terms of energy and performance
  • Covers topics not available in other books, such as NoC and distributed memory organization, dynamic memory management and abstract data type support in many-core platforms, and distributed hierarchical power management

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Table of contents (11 chapters)

  1. Network-on-Chip Design Methodology

  2. Suggested Projects

Keywords

About this book

This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.

Authors and Affiliations

  • Dept of Computer Science and Engineering, Frederick University School of Applied Sciences, Nicosia, Cyprus

    Konstantinos Tatas

  • Department of Computer Science, National Technical University of Athens, Athens, Greece

    Kostas Siozios, Dimitrios Soudris

  • Department of Electronic Systems, Royal Institute of Technology, Kista, Sweden

    Axel Jantsch

Bibliographic Information

  • Book Title: Designing 2D and 3D Network-on-Chip Architectures

  • Authors: Konstantinos Tatas, Kostas Siozios, Dimitrios Soudris, Axel Jantsch

  • DOI: https://doi.org/10.1007/978-1-4614-4274-5

  • Publisher: Springer New York, NY

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Science+Business Media New York 2014

  • Hardcover ISBN: 978-1-4614-4273-8

  • Softcover ISBN: 978-1-4939-4550-4

  • eBook ISBN: 978-1-4614-4274-5

  • Edition Number: 1

  • Number of Pages: XIII, 265

  • Number of Illustrations: 65 b/w illustrations, 79 illustrations in colour

  • Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Processor Architectures

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