Editors

Editor-In-Chief

F. Shadi Shahedipour-Sandvik, SUNY Polytechnic Institute, Albany, NY

Senior Editor

John D. Baniecki, SLAC National Accelerator Laboratory, Stanford University, Menlo Park, CA

Section Editors

Wojciech Jadwisienczak, Ohio University, Athens, OH
Dong-Hau Kuo, National Taiwan University of Science and Technology, Taipei, Taiwan
Dan Ricinschi, Tokyo Institute of Technology, Tokyo, Japan

Deputy Section Editors

Ching-Ting Lee, National Cheng Kung University, Tainan City, Taiwan
Cheuk-Wai Tai, Arrhenius Laboratory, Stockholm University, Stockholm, Sweden
 

Editorial Oversight Committee

T. Bieler, Michigan State University, East Lansing, MI
M. M. Hussain, King Abdullah University of Science and Technology, Thuwal, Saudi Arabia
F. Iacopi, University of Technology Sydney, Sydney, Australia
R. J. Kaplar, Sandia National Laboratory, Albuquerque, NM
L. Porter, Carnegie Mellon University, Pittsburgh, PA

Associate Editors

Chemistry, Biomedicine, Biotechnology, and Catalysts
Hani Nasser Abdelhamid, Assiut University, Assiut, Egypt

III-V and II-VI Semiconductor Materials
John E. Ayers, University of Connecticut, Storrs, CT

III-V As and Sb Based Materials and Devices
Ganesh Balakrishnan, University of New Mexico, Albuquerque, NM

II-VI Materials and Electronic Devices, Crystallography and Defects
Gregory Brill, Army Research Laboratory, Adelphi, MD

Interfaces and Contacts
L.J. Brillson, The Ohio State University, Columbus, OH

Complex Oxides/Superconductors, Ferroelectric and Magnetic Materials, and Solid Oxide Fuel Cells
Tomasz Brylewski, AGH University of Science and Technology, Krakow, Poland

SiC, Plasmonics, Metamaterials, Phonon, Polaritons, and Emitters
Joshua Caldwell, Vanderbilt University, Nashville, Tennessee

Electrocatalysis, Electrochemical Energy Technologies, Nanocomposites and Antimicrobial Application
Shaowei Chen, University of California-Santa Cruz, Santa Cruz, CA

Packaging and Interconnects
Sinn-wen Chen, National Tsing Hua University, Hsin-chu, Taiwan

Thermal Management and Composite Materials
Deborah Chung, University at Buffalo, Buffalo, NY

Organic Optoelectronics, Organic/Rerovskite Solar Cells and Microelectronics
Yu Duan, Jilin University, Changchun, China

Interconnects and Nanocharacterization
Kathleen Dunn, SUNY Polytechnic Institute, Albany, NY

Materials Integration
Kurt G. Eyink, Air Force Research Laboratory, WPAFB, OH

Processing and Physical Properties of Electronic Ceramics
Tsang-Tse Fang, National Cheng Kung University, Tainan City, Taiwan

Thermoelectric Materials and Devices, Perovskites, Energy Harvesting Systems
Armin Feldhoff, Institute of Physical Chemistry and Electrochemistry, Hannover, Germany

Microstructural Evolution, Oxide Semiconductor Materials and Devices, Dielectrics, Ferroelectrics, and Magnetic Materials
Antonio Feteira, Sheffield Hallam University, Sheffield, United Kingdom

Packaging and Interconnects
Darrel Frear, NXP Semiconductors, Tempe, AZ

Materials Theory and Modeling, Defects and Doping, Complex Functional Materials
Khang Hoang, North Dakota State University, Fargo, ND

Electronic and Ionic Transport in Nonionic Materials
Doo Seok Jeong, Korea Instit ute of Science and Technology, Seoul, South Korea

Modeling and Simulation of 2D Electronic Devices, Advanced MOSFETs, Organic Thin Film Devices, and Metal Oxide Nanostructures
Satyabrata Jit, Indian Institute of Technology (BHU), Varanasi, India

Phase Change Memory, Photonic and Optoelectronic
Pei-Cheng Ku, University of Michigan, Ann Arbor, MI

Packaging and Interconnects
Tae-Kyu Lee, Cisco Systems, San Jose, CA

Chalcogenides Optoelectronic Materials, Interfaces and Devices
Fangyang Liu, Central South University, Changsha, China

Electronic Materials for Applications in Energy, Photocatalytic, and Electrochemistry
Tianyi Ma, RMIT University, Melbourne, Australia

Solar Energy Materials, Solar Cells, and Photovoltaics
Arturo Morales-Acevedo, CINVESTAV-IPN, México, D. F., México

Sensors, Microstructural Evolution and Packaging
Govindarajan Muralidharan, Oak Ridge National Laboratory, Oak Ridge, TN

Nanostructured and Nanocomposite Materials, Novel Sensors
Paul R. Ohodnicki, University of Pittsburgh, Pittsburgh, PA

Microwave Absorbing Composite Materials, Ferromagnetic Microwires
Faxiang Qin, Zhejiang University, Hangzhou, China

Microwave Properties of Dielectrics and Antennas, Dielectric Resonators
M.T. Sebastian, University of Oulu, Oulu, Finland

III-V and II-VI Optoelectronic Devices
Jens W. Tomm, Max-Born-Institute, Berlin, Germany

Crystalline and Amorphous Oxide Semiconductors and Devices,Combinatorial Material Science
Holger von Wenckstern, Universität Leipzig, Leipzig, Germany

Graphene/2D Materials; Chalcogenides; Electronic Materials for Energy Including Electrochemical and Photo-catalytic Applications
Xinhui Xia, Zhejiang University, Hangzhou, China

Luminescence and Related Phenomena in WBG Semiconductors, Phosphors and Mechanisms of Many-Body Luminescence, PV, and Photonics
Shijie Xu, The University of Hong Kong, Hong Kong

Computational Materials Science for Energy Applications, Electronic, and Optoelectronic; Thermoelectric Properties of Nanomaterials
Gang Zhang, Agency for Science, Technology and Research (A*STAR), Singapore

Theoretical and Computational Physics and Chemistry, Electronic Materials for Energy Including Electrochemical and Photo-Catalytic Applications
Rui-Qin Zhang, City University of Hong Kong, Kowloon, Hong Kong SAR