RF and Microwave Microelectronics Packaging II

Editors: Kuang, Ken, Sturdivant, Rick (Eds.)

    • Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis
    • Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies
    • Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers
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eBook 71,39 €
price for India (gross)
  • ISBN 978-3-319-51697-4
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 84,99 €
price for India (gross)
  • ISBN 978-3-319-51696-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

About the authors

Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in San Diego Business Journal 100 Fastest Growing Private Companies in San Diego. Kuang was three times the finalist for the Most Admired CEO in San Diego. 
Rick Sturdivant has been President of Microwave Packaging Technology, Inc. (MPT) since 2003. He regularly presents at conference workshops and other venues, and has been a guest lecturer at Georgia Tech Research Institute. He is a recognized expert in the field of Transmit/Receive (T/R) modules for phased array radar and communication systems.

Table of contents (11 chapters)

  • Introduction to Radio Frequency and Microwave Microelectronic Packaging

    Sturdivant, Rick

    Pages 1-17

    Preview Buy Chapter 24,95 €
  • Packaging of Transmit/Receive Modules

    Sturdivant, Rick

    Pages 19-32

    Preview Buy Chapter 24,95 €
  • 3D Transitions and Connections

    Sturdivant, Rick

    Pages 33-42

    Preview Buy Chapter 24,95 €
  • Electromagnetic Shielding for RF and Microwave Packages

    Karim, Nozad

    Pages 43-62

    Preview Buy Chapter 24,95 €
  • Design of C-Band Interdigital Filter and Compact C-Band Hairpin Bandpass Film Filter on Thin Film Substrate

    Tan, Min (et al.)

    Pages 63-73

    Preview Buy Chapter 24,95 €

Buy this book

eBook 71,39 €
price for India (gross)
  • ISBN 978-3-319-51697-4
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 84,99 €
price for India (gross)
  • ISBN 978-3-319-51696-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
RF and Microwave Microelectronics Packaging II
Editors
  • Ken Kuang
  • Rick Sturdivant
Copyright
2017
Publisher
Springer International Publishing
Copyright Holder
Springer International Publishing AG
eBook ISBN
978-3-319-51697-4
DOI
10.1007/978-3-319-51697-4
Hardcover ISBN
978-3-319-51696-7
Edition Number
1
Number of Pages
XII, 172
Number of Illustrations and Tables
50 b/w illustrations, 77 illustrations in colour
Topics