Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

1. Front Matter

   Pages i-xx

   PDF

2. Introduction

   1. Front Matter

      Pages 1-1

      PDF

   2. Challenges in ULSI Interconnects - Introduction to the Book

      • Y. Shacham-Diamand

      Pages 3-11

3. Technology Background

   1. Front Matter

      Pages 13-13

      PDF

   2. MOS Device and Interconnects Scaling Physics

      • Marc Van Rossum

      Pages 15-38

   3. Interconnects in ULSI Systems: Cu Interconnects Electrical Performance

      • Avinoam Kolodny

      Pages 39-62

   4. Electrodeposition

      • Madhav Datta

      Pages 63-71

   5. Electrophoretic Deposition

      • David Brandon

      Pages 73-78

   6. Wafer-Level 3D Integration for ULSI Interconnects

      • Ronald J. Gutmann, Jian-Qiang Lu

      Pages 79-90

4. Interconnect Materials

   1. Front Matter

      Pages 91-92

      PDF

   2. Diffusion Barriers for Ultra-Large-Scale Integrated Copper Metallization

      • A. Kohn, M. Eizenberg

      Pages 93-120

   3. Silicides

      • Osamu Nakatsuka, Shigeaki Zaima

      Pages 121-130

   4. Materials for ULSI metallization - Overview of Electrical Properties

      • S. Tsukimoto, K. Ito, M. Murakami

      Pages 131-143

   5. Low-κ Materials and Development Trends

      • Akira Hashimoto, Ichiro Koiwa

      Pages 145-151

   6. Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects

      • Hyun Park, Matthias Kraatz, Jay Im, Bernd Kastenmeier, Paul S. Ho

      Pages 153-167

   7. ALD Seed Layers for Plating and Electroless Plating

      • Jay J. Senkevich

      Pages 169-179

5. Deposition Processes for ULSI Interconnects

   1. Front Matter

      Pages 181-182

      PDF

   2. Electrochemical Processes for ULSI Interconnects

      • Tetsuya Osaka, Madoka Hasegawa, Masahiro Yoshino, Noriyuki Yamachika

      Pages 183-205

   3. Atomic Layer Deposition (ALD) Processes for ULSI Manufacturing

      • Schubert S. Chu

      Pages 207-220

   4. Electroless Deposition Approaching the Molecular Scale

      • A.M. Bittner

      Pages 221-235

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

• CMOS
• Wafer
• chemistry
• development
• electrochemistry
• integrated circuit
• interconnect
• manufacturing
• modeling
• nanotechnology
• scaling
• vapor

• Tel Aviv University, Ramat Aviv, Tel Aviv, Israel

  Yosi Shacham-Diamand

• Dept. Applied Chemistry, Waseda University, Tokyo, Japan

  Tetsuya Osaka

• Emerson Network Power, Cooligy Precision Cooling, Mountain View, U.S.A.

  Madhav Datta

• Division of Corporate Relations, The University of Tokyo, Tokyo , Japan

  Takayuki Ohba

Policies and ethics