Skip to main content
Book cover

Nanopackaging

Nanotechnologies and Electronics Packaging

  • Book
  • © 2018

Overview

  • Discusses the importance of computer modeling in nanopackaging and offers suggestions for implementation
  • Contains 12 new chapters from internationally recognized contributors, as well as updates in all existing chapters
  • Brings together a comprehensive overview of nanoscale electronics and systems and covers structures, nanoelectronics packaging and interconnects, and offers a roadmap for future trends

This is a preview of subscription content, log in via an institution to check access.

Access this book

eBook USD 169.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

Table of contents (32 chapters)

Keywords

About this book

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement.

Now in a widely extended second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. Twelve new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.



Editors and Affiliations

  • Department of Electrical and Computer Engineering, Portland State University, Portland, USA

    James E. Morris

About the editor

James E. Morris is Professor of Electrical & Computer Engineering at Portland State University, Oregon. He has edited or co-authored five books on electronic packaging, and has more on the way.

Bibliographic Information

  • Book Title: Nanopackaging

  • Book Subtitle: Nanotechnologies and Electronics Packaging

  • Editors: James E. Morris

  • DOI: https://doi.org/10.1007/978-3-319-90362-0

  • Publisher: Springer Cham

  • eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)

  • Copyright Information: Springer International Publishing AG, part of Springer Nature 2018

  • Hardcover ISBN: 978-3-319-90361-3Published: 02 October 2018

  • Softcover ISBN: 978-3-030-07999-4Published: 10 January 2019

  • eBook ISBN: 978-3-319-90362-0Published: 22 September 2018

  • Edition Number: 2

  • Number of Pages: XXVIII, 996

  • Number of Illustrations: 216 b/w illustrations, 419 illustrations in colour

  • Topics: Nanotechnology, Electronics and Microelectronics, Instrumentation, Electrochemistry

Publish with us