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Electro-Chemo-Mechanics of Solids

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  • © 2017

Overview

  • Introduces a novel multi-disciplinary field of investigation, combining electrical, chemical, and mechanical properties in a simultaneous fashion
  • Illustrates the role of Electro-Chemo-Mechanics in ionic conductivity, relationships between in- and out-of-plane lattice constants, and energy for oxygen vacancy formation
  • Describes new in situ techniques, for example, strain microscopy to locally probe electro-chemo-mechanical effects of thin film and bulk materials
  • Maximizes reader understanding of a wide range of technological applications, including solid oxide fuel cells/electrolyzers, Li-ion batteries, and electrochemical capacitors
  • Includes supplementary material: sn.pub/extras

Part of the book series: Electronic Materials: Science & Technology (EMST)

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Table of contents (8 chapters)

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About this book

This book brings together a collection of chapters that focus on the relationship among electrical, chemical, and mechanical properties and the study of adjusting one property through the control of another, namely, Electro-Chemo-Mechanics (ECM). The authors examine how this relationship can result in beneficial properties, such as mixed ionic and electronic conductivity, in oxides, upon oxygen deficiency or lithium insertion (electro-chemo) and/or changes in ionic and electronic mobility observed in strained systems (electro-mechano). They also consider how ECM interactions can be responsible for large stresses from non-stoichiometry induced lattice dilation (chemo-mechano). While many volumes are available devoted to the study of the origins and characteristics of electro-chemical relationships, they form the well-known field of electrochemistry, this volume is highly novel in its examination of the corresponding electro-mechanical, chemo-mechanical, and electro-chemo-mechanical relationships. The book is ideal for researchers and design engineers interested in energy storage and conversion and the electrical and mechanical properties of materials.

Editors and Affiliations

  • Massachesetts Institute of Technology, Cambridge, USA

    Sean R. Bishop

  • Kyushu University, Kyushu, Japan

    Nicola H. Perry

  • Massachusetts Institute of Technology, Cambridge, USA

    Dario Marrocchelli

  • Brown University, Providence, USA

    Brian W. Sheldon

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