Microsystem Design

1. Front Matter

   Pages i-xxvi

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2. Getting Started

   1. Introduction

      Pages 3-14

   2. An Approach to Mems Design

      Pages 15-28

   3. Microfabrication

      Pages 29-78

   4. Process Integation

      Pages 79-99

3. Modeling Strategies

   1. Lumped Modeling with Circuit Elements

      Pages 103-124

   2. Energy-conserving Transducers

      Pages 125-147

   3. Lumped-element System Dynamics

      Pages 149-180

4. Domain-Specific Details

   1. Elasticity

      Pages 183-200

   2. Structures

      Pages 201-238

   3. Energy Methods

      Pages 239-265

   4. Dissipation and the Thermal Energy Domain

      Pages 267-297

   5. Lumped Modeling of Dissipative Processes

      Pages 299-315

   6. Fluids

      Pages 317-350

5. Circuit and System Issues

   1. Electronics

      Pages 353-396

   2. Feedback Systems

      Pages 397-423

   3. Noise

      Pages 425-450

6. Case Studies

   1. Packaging

      Pages 453-468

   2. A Piezoresistive Pressure Sensor

      Pages 469-495

   3. A Capacitive Accelerometer

      Pages 497-530

It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.

• Sensor
• Software
• Transducer
• electronics
• manufacturing
• microelectromechanical system (MEMS)
• microsystems
• modeling

• Massachusetts Institute of Technology, USA

  Stephen D. Senturia

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