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Table of contents (14 chapters)
Keywords
About this book
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
Reviews
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)
Bibliographic Information
Book Title: Foldable Flex and Thinned Silicon Multichip Packaging Technology
Editors: John W. Balde
Series Title: Emerging Technology in Advanced Packaging
DOI: https://doi.org/10.1007/978-1-4615-0231-9
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 2003
Hardcover ISBN: 978-0-7923-7676-7Published: 31 January 2003
Softcover ISBN: 978-1-4613-4977-8Published: 23 February 2014
eBook ISBN: 978-1-4615-0231-9Published: 27 November 2013
Series ISSN: 1572-087X
Edition Number: 1
Number of Pages: XIX, 347
Number of Illustrations: 266 b/w illustrations
Topics: Manufacturing, Machines, Tools, Processes, Theoretical and Computational Chemistry, Electrical Engineering, Optical and Electronic Materials