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Engineering - Robotics | Copper Wire Bonding (Authors and Editors)

Copper Wire Bonding

Chauhan, P.S., Choubey, A., Zhong, Z., Pecht, M.G.

2014, XXVI, 235 p. 104 illus., 20 illus. in color.

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Preeti Chauhan is a researcher from the Center for Advanced Life Cycle Engineering at the University of Maryland. She is currently a technology development Q&R engineer at Intel Corporation.

Anupam Choubey is a consultant in the area of packaging engineering in the Boston, MA area.

ZhaoWei Zhong is a Professor of Mechanical and Aerospace Engineering at Nanyang Technological University.

Michael Pecht is a world renowned reliability engineer and educator. He is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland.

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