Authors:
- Heat sinks is a topic related to functioning of electronic microdevices
- This topic is systematically presented in this book for the first time
- Includes supplementary material: sn.pub/extras
Part of the book series: Microtechnology and MEMS (MEMS)
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Table of contents (7 chapters)
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Front Matter
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Back Matter
About this book
Authors and Affiliations
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Molecular Nanosystems, Palo Alto, USA
Lian Zhang
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Department of Mechanical Engineering, Stanford University, Stanford, USA
Kenneth E. Goodson, Thomas W. Kenny
Bibliographic Information
Book Title: Silicon Microchannel Heat Sinks
Book Subtitle: Theories and Phenomena
Authors: Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
Series Title: Microtechnology and MEMS
DOI: https://doi.org/10.1007/978-3-662-09899-8
Publisher: Springer Berlin, Heidelberg
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eBook Packages: Springer Book Archive
Copyright Information: Springer-Verlag Berlin Heidelberg 2004
Hardcover ISBN: 978-3-540-40181-0Published: 26 November 2003
Softcover ISBN: 978-3-642-07282-6Published: 10 April 2011
eBook ISBN: 978-3-662-09899-8Published: 14 March 2013
Series ISSN: 1615-8326
Series E-ISSN: 2365-0680
Edition Number: 1
Number of Pages: IX, 141
Number of Illustrations: 92 b/w illustrations, 4 illustrations in colour
Topics: Electronics and Microelectronics, Instrumentation, Condensed Matter Physics, Engineering, general