Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Fischer-Hirchert, Ulrich H. P.
2015, 320 p. 50 illus.
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Provides an overview of today's state-of-the-art technologies Guides the reader to the practical use of optical connectors
Helps engineers to find a way to an effective and inexpensive set-up for their own needs
Illustrates recent reliability test procedures for datacom and telecom modules in combination with related standardization aspects
The field of packaging of photonic devices is very broad and diverse. This book is the first and only comprehensive sourcebook on photonic assembly techniques. For photonic packaging experts and professionals in corresponding technologies, it provides an overview of today's state-of-the-art technologies. From basic calculations to optimize the fiber – chip – coupling efficiency, the content will guide the reader to the practical use of optical connectors. Active and passive adjustment and coupling basics in combination with many examples will help the engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of actual industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Up to date simulation techniques like FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
Content Level »Professional/practitioner
Keywords »Fiber chip coupling - Multi fiber coupling - Optical communication systems - Optical packaging design