Authors:
- Provides an up-to-date overview on lead-free soldering technologies
- Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniques
- Explores emerging technologies in lead-free soldering
- Includes supplementary material: sn.pub/extras
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Table of contents (8 chapters)
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Front Matter
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Back Matter
About this book
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Reviews
From the book reviews:
“The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)
Authors and Affiliations
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Cisco Systems, Inc., San Jose, USA
Tae-Kyu Lee
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Michigan State University, East Lansing, USA
Thomas R. Bieler
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Department of Materials Science and Engineering, University of Texas, Arlington, Arlington, USA
Choong-Un Kim
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Lightera Corp., Sunnyvale, USA
Hongtao Ma
Bibliographic Information
Book Title: Fundamentals of Lead-Free Solder Interconnect Technology
Book Subtitle: From Microstructures to Reliability
Authors: Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
DOI: https://doi.org/10.1007/978-1-4614-9266-5
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media New York 2015
Hardcover ISBN: 978-1-4614-9265-8Published: 06 November 2014
Softcover ISBN: 978-1-4899-7801-1Published: 01 October 2016
eBook ISBN: 978-1-4614-9266-5Published: 05 November 2014
Edition Number: 1
Number of Pages: XIII, 253
Number of Illustrations: 70 b/w illustrations, 81 illustrations in colour
Topics: Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Circuits and Systems