Editors:
- Broad-ranging chapters with a focus on IC-package-system integration
- Provides viewpoints from leading industry executives and experts
- Details state-of-the-art achievements in process technologies and scientific research
- Presents a clear development history and touches on trends in the industry, while also discussing up-to-date technology information
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Table of contents (11 chapters)
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Front Matter
About this book
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Editors and Affiliations
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ASE Group, Kaohsiung, Taiwan R.O.C.
Ho-Ming Tong, Yi-Shao Lai
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, Department of Engineering, The Chinese University of Hong Kong, Hong Kong, SAR, China, People's Republic
C.P. Wong
Bibliographic Information
Book Title: Advanced Flip Chip Packaging
Editors: Ho-Ming Tong, Yi-Shao Lai, C.P. Wong
DOI: https://doi.org/10.1007/978-1-4419-5768-9
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media New York 2013
Hardcover ISBN: 978-1-4419-5767-2Published: 21 March 2013
Softcover ISBN: 978-1-4899-7933-9Published: 23 August 2016
eBook ISBN: 978-1-4419-5768-9Published: 20 March 2013
Edition Number: 1
Number of Pages: VII, 560
Topics: Electronics and Microelectronics, Instrumentation, Circuits and Systems, Optical and Electronic Materials