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Engineering - Electronics & Electrical Engineering | Advanced Flip Chip Packaging

Advanced Flip Chip Packaging

Tong, Ho-Ming, Lai, Yi-Shao, Wong, C.P. (Eds.)

2013, VII, 560 p. 413 illus., 242 illus. in color.

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  • Offers broad-ranging chapters with a focus on IC-package-system integration
  • Provides viewpoints from leading industry executives and experts
  • Details state-of-the-art achievements in process technologies and scientific research
  • Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

This book also:

  • Offers broad-ranging chapters with a focus on IC-package-system integration
  • Provides viewpoints from leading industry executives and experts
  • Details state-of-the-art achievements in process technologies and scientific research
  • Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information

Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

Content Level » Research

Keywords » Assembly Technologies - Bumping Technology - Electrical and Thermal Design - Electromigration - Flip Chip Packaging - IC Packaging - IC-Package-System-Integration - Substrate Packaging - Thermomechanical Reliability - Thermomigration

Related subjects » Circuits & Systems - Electronics & Electrical Engineering - Optical & Electronic Materials

Table of contents 

Flip Chip Technology Overview and Early Beginnings.- Technology Trends of Flip Chip.- Bumping Technologies.- Flip-Chip Interconnections: Past, Present and Future.- Underfill.- Conductive Adhesives for Flip Chip Applications.- Enabling Substrate Technologies: Past, Present and Future.- IC-Package-System Integrated Design.- Thermal Management of Flip Chip Packages.- Thermo-Mechanical Reliability in Flip Chip Packages.-  Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.

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