Logo - springer
Slogan - springer

Engineering - Electronics & Electrical Engineering | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics,… - Volume I Materials (Authors and Editors)

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

Suhir, Ephraim, Lee, Y.C., Wong, C.P. (Eds.)

2007, LXII, 1460 p. In 2 volumes, not available separately.

Available Formats:
eBook
Information

Springer eBooks may be purchased by end-customers only and are sold without copy protection (DRM free). Instead, all eBooks include personalized watermarks. This means you can read the Springer eBooks across numerous devices such as Laptops, eReaders, and tablets.

You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal.

After the purchase you can directly download the eBook file or read it online in our Springer eBook Reader. Furthermore your eBook will be stored in your MySpringer account. So you can always re-download your eBooks.

 
$599.00

(net) price for USA

ISBN 978-0-387-32989-5

digitally watermarked, no DRM

Included Format: PDF

download immediately after purchase


learn more about Springer eBooks

add to marked items

Hardcover
Information

Hardcover version

You can pay for Springer Books with Visa, Mastercard, American Express or Paypal.

Standard shipping is free of charge for individual customers.

 
$759.00

(net) price for USA

ISBN 978-0-387-27974-9

free shipping for individuals worldwide

usually dispatched within 3 to 5 business days


add to marked items

Dr. Ephraim Suhir is Distinguished Member of Technical Staff (retired), Basic Research, Physical Sciences and Engineering Research Division, Bell Labs, Murray Hill, NJ. He is currently on the faculty of the Electrical Engineering Department, University of California, Santa Cruz, CA and the Department of Mechanical Engineering, University of Maryland, College Park, MD. Dr. Suhir is Fellow of the American Physical Society (APS), the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), and the Society of Plastics Engineers (SPE). He is co-founder (with Dr. Peter Engel) of the ASME Journal of Electronic Packaging and served as its Technical Editor for eight years (1993-2001).   He has received numerous distinguished service and professional awards, including 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering; 2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry; 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society; 2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering; and 1999 ASME and Pi-Tau-Sigma Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering.

Prof. C. P. Wong is a Regents’ Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering at Georgia Institute of technology. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University.  He joined AT&T Bell Laboratories in 1977 as a member of the technical staff and in 1992, he was elected as an AT&T Bell Laboratories Fellow for his fundamental contributions to low-cost high performance plastic packaging of semiconductors. Since 1996, he is a Professor at the School of Materials Science and Engineering at the Georgia Institute of Technology. He has received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding and Best Paper Awards in 1990, 1991, 1994, 1996, 1998, 2002, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002 and the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006.  Dr. Wong is a Fellow of the IEEE, AIC, and AT&T Bell Labs, and was the technical vice president (1990 &1991), and the president of the IEEE-CPMT Society (1992 &1993). He was elected a member of the National Academy of Engineering in 2000.

Professor Y. C. Lee is a Professor of Mechanical Engineering. He was the Chair of ASME Electronic and Photonic Packaging Division (EPPD) from 2004 to 2005. From 1993 to 2002, he was an Associate Director of the Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, University of Colorado at Boulder. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey.  Dr. Lee was an Associated Editor of ASME Journal of Electronic Packaging from 2001 to 2004 and a Guest Editor for IEEE Transaction on Advanced Packaging in 2003 and 2005. He has received several awards: ASME Fellow, December 2002, Presidential Young Investigator (National Science Foundation, 1990), Outstanding Young Manufacturing Engineer Award (SME, 1992), Outstanding Paper Award (IEEE-ECTC, 1991), Outstanding Paper Award (ASME J. of Electronic Packaging, 1993), IEEE Transactions on Advanced Packaging Honorable Mention Paper Award, 2003

 

 

Other books by these authors 

Books & CD ROMs

Show all 7 results

  • Manufacturing Challenges in Electronic Packaging
    • eBook
      download immediately after purchase

      $139.00
      (net)

      Hardcover
      usually dispatched within 3 to 5 business days

      $199.00
      (net)

      Softcover
      usually dispatched within 3 to 5 business days

      $179.00
      (net)
      All
    • eBook
      download immediately after purchase

      $139.00
      (net)

      Hardcover
      usually dispatched within 3 to 5 business days

      $199.00
      (net)

      Softcover
      usually dispatched within 3 to 5 business days

      $179.00
      (net)

    Manufacturing Challenges in Electronic Packaging

    Lee, Y.C., Chen, W.T. (Eds.) 1998

    Price from $139.00
    Available Formats:
    Information
    $139.00 (net)
    ISBN 978-1-4615-5803-3
    download immediately after purchase
    eBook
    This title is also available as an eBook. You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal. After the purchase you can directly download the eBook file or read it online. Via MySpringer you can always re-download your eBooks.
    Information
    $199.00 (net)
    ISBN 978-0-412-62030-0
    usually dispatched within 3 to 5 business days
    Hardcover
    Hardcover version
    Information
    $179.00 (net)
    ISBN 978-1-4613-7659-0
    usually dispatched within 3 to 5 business days
    Softcover
    Softcover (also known as softback) version
  • Electrical Conductive Adhesives with Nanotechnologies
    • eBook
      download immediately after purchase

      $119.00
      (net)

      Hardcover
      usually dispatched within 3 to 5 business days

      $149.00
      (net)
      All
    • eBook
      download immediately after purchase

      $119.00
      (net)

      Hardcover
      usually dispatched within 3 to 5 business days

      $149.00
      (net)

    Electrical Conductive Adhesives with Nanotechnologies

    Li, Yi (Grace), Lu, Daniel, Wong, C.P. 2010

    Price from $119.00
    Selected Formats
    Information
    $119.00 (net)
    ISBN 978-0-387-88783-8
    download immediately after purchase
    eBook
    This title is also available as an eBook. You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal. After the purchase you can directly download the eBook file or read it online. Via MySpringer you can always re-download your eBooks.
    Information
    $149.00 (net)
    ISBN 978-0-387-88782-1
    usually dispatched within 3 to 5 business days
    Hardcover
    Hardcover version
  • Materials for Advanced Packaging
    • eBook
      download immediately after purchase

      $119.00
      (net)

      Hardcover
      usually dispatched within 3 to 5 business days

      $149.00
      (net)

      Softcover
      usually dispatched within 3 to 5 business days

      $149.00
      (net)
      All
    • eBook
      download immediately after purchase

      $119.00
      (net)

      Hardcover
      usually dispatched within 3 to 5 business days

      $149.00
      (net)

      Softcover
      usually dispatched within 3 to 5 business days

      $149.00
      (net)

    Materials for Advanced Packaging

    Lu, Daniel, Wong, C.P. (Eds.) 2009

    Price from $119.00
    Available Formats:
    Information
    $119.00 (net)
    ISBN 978-0-387-78219-5
    download immediately after purchase
    eBook
    This title is also available as an eBook. You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal. After the purchase you can directly download the eBook file or read it online. Via MySpringer you can always re-download your eBooks.
    Information
    $149.00 (net)
    ISBN 978-0-387-78218-8
    usually dispatched within 3 to 5 business days
    Hardcover
    Hardcover version
    Information
    $149.00 (net)
    ISBN 978-1-4419-4611-9
    usually dispatched within 3 to 5 business days
    Softcover
    Softcover (also known as softback) version
  • Structural Analysis in Microelectronic and Fiber-Optic Systems
    • eBook
      download immediately after purchase

      $69.99
      (net)

      Softcover
      usually dispatched within 3 to 5 business days

      $99.00
      (net)
      All
    • eBook
      download immediately after purchase

      $69.99
      (net)

      Softcover
      usually dispatched within 3 to 5 business days

      $99.00
      (net)

    Structural Analysis in Microelectronic and Fiber-Optic Systems

    Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis

    Suhir, Ephraim 1991

    Price from $69.99
    Available Formats:
    Information
    $69.99 (net)
    ISBN 978-94-011-6535-8
    download immediately after purchase
    eBook
    This title is also available as an eBook. You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal. After the purchase you can directly download the eBook file or read it online. Via MySpringer you can always re-download your eBooks.
    Information
    $99.00 (net)
    ISBN 978-94-011-6537-2
    usually dispatched within 3 to 5 business days
    Softcover
    Softcover (also known as softback) version
  • Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
    • eBook
      download immediately after purchase

      $599.00
      (net)
    • eBook
      download immediately after purchase

      $599.00
      (net)

    Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

    Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

    Suhir, Ephraim, Lee, Y.C., Wong, C.P. (Eds.) 2007

    Price from $599.00
    Selected Formats
    Information
    $599.00 (net)
    ISBN 978-0-387-32989-5
    download immediately after purchase
    eBook
    This title is also available as an eBook. You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal. After the purchase you can directly download the eBook file or read it online. Via MySpringer you can always re-download your eBooks.


5 of 7

 

Articles

Read this Book on Springerlink

Services for this book

New Book Alert

Get alerted on new Springer publications in the subject area of Electronics and Microelectronics, Instrumentation.