Structural Integrity and Reliability in Electronics

1. Front Matter

   Pages i-xix

   PDF

2. The Materials Perspective

   1. Setting the Scene

      Pages 3-17

   2. Introduction to the Properties of Materials

      Pages 19-32

   3. More Complex Mechanical Behaviour

      Pages 33-49

   4. Mechanical Testing (For Electronics Applications)

      Pages 51-68

   5. Mechanical Properties of Bulk Solders

      Pages 69-97

   6. Mechanical Behaviour of Solder Joints

      Pages 99-115

3. The Manufacture’s Perspective

   1. Electronic Components and Their Construction

      Pages 119-148

   2. Printed Circuit Board Assembly Methods and Technologies

      Pages 149-165

   3. Fundamentals of Failure Analysis

      Pages 167-182

   4. Analysis of PCB and Electronic Component Failure

      Pages 183-203

   5. Making the Transition to a Reliable Lead-free Solder Process

      Pages 205-213

4. The Designer’s Perspective

   1. Introduction to Life Prediction

      Pages 217-238

   2. Life Prediction by Crack Propagation Approach

      Pages 239-255

   3. Reliability and Statistical Analysis of Data

      Pages 257-273

   4. Thermal and Mechanical Simulation in Microelectronics

      Pages 275-286

   5. Finite Element Analysis

      Pages 287-303

   6. Non-linear Finite Element Analysis

      Pages 305-318

   7. Case Study

      Pages 319-329

5. Back Matter

   Pages 331-336

   PDF

Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.

• Statistica
• alloy
• calculus
• circuit
• communication
• construction
• design
• electronics
• environment
• finite element method
• material
• microelectronics
• simulation
• statistical analysis

• The Open University, Milton Keynes, UK

  W. J. Plumbridge, R. J. Matela

• Rohm Electronics (UK) Ltd, Milton Keynes, UK

  A. Westwater

Policies and ethics