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Provides fundamental modeling of TSV which is a very essential part of 3D ICs
Includes both numerical formula analysis and qualitative explanations
Approach from various view points: signal integrity, power integrity and etc.
Has appeal for academia and industry
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Content Level »Research
Keywords »3-Dimensional Integrated Circuit Design - Clock Distribution Networks - High Speed IC Design - Noise Coupling - On-Chip Decoupling - Power Distribution Networks - Power Integrity - Signal Integrity - Thermal Effects - Through Silicon Via (TSV)