Overview
- The first book on exposing the technical details of various 3-D field solvers for RC extraction
- Challenging issues faced by the capacitance extraction under nanometer technology are covered with the state-of-the-art techniques
- The direct boundary element method is comprehensively introduced as an efficient modeling technique for interconnect and substrate structures with arbitrary dielectric configurations
- Several techniques discussed have been broadly used in IC industry for RC extraction
- Practical examples and over 60 illustrations
- Includes supplementary material: sn.pub/extras
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Table of contents (11 chapters)
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Front Matter
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Back Matter
Keywords
About this book
Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm.
This book will benefit graduate students and researchers in the field of electrical and computer engineering as well as engineers working in the IC design and design automation industries.
Dr. Wenjian Yu is an Associate Professor at the Department of Computer Science and Technology at Tsinghua University in China; Dr. Xiren Wang is a R&D Engineer at Cadence Design Systems in the USA.
Authors and Affiliations
Bibliographic Information
Book Title: Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits
Authors: Wenjian Yu, Xiren Wang
DOI: https://doi.org/10.1007/978-3-642-54298-5
Publisher: Springer Berlin, Heidelberg
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Tsinghua University Press, Beijing and Springer-Verlag Berlin Heidelberg 2014
Hardcover ISBN: 978-3-642-54297-8Published: 05 May 2014
Softcover ISBN: 978-3-662-51022-3Published: 03 September 2016
eBook ISBN: 978-3-642-54298-5Published: 21 April 2014
Edition Number: 1
Number of Pages: XV, 246
Number of Illustrations: 104 b/w illustrations
Additional Information: Jointly published with Tsinghua University Press, Beijing, China
Topics: Circuits and Systems, Computer-Aided Engineering (CAD, CAE) and Design, Computational Science and Engineering, Numerical Analysis, Simulation and Modeling