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Hybrid Fault Tolerance Techniques to Detect Transient Faults in Embedded Processors

  • Book
  • © 2014

Overview

  • Discusses the effects of radiation on modern integrated circuits
  • Provides a comprehensive overview of state-of-the art fault tolerance techniques based on software, hardware, and hybrid techniques
  • Introduces novel hybrid fault tolerance techniques for reconfigurable FPGAs and ASICs
  • Performs fault injection campaigns by simulation, bitstream fault injection, and radiation experiments
  • Enables readers to use techniques with lower performance degradation, area occupation, and memory usage
  • Includes supplementary material: sn.pub/extras

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Table of contents (8 chapters)

Keywords

About this book

This book describes fault tolerance techniques based on software and hardware to create hybrid techniques. They are able to reduce overall performance degradation and increase error detection when associated with applications implemented in embedded processors.  Coverage begins with an extensive discussion of the current state-of-the-art in fault tolerance techniques.  The authors then discuss the best trade-off between software-based and hardware-based techniques and introduce novel hybrid techniques. Proposed techniques increase existing fault detection rates up to 100%, while maintaining low performance overheads in area and application execution time.

Authors and Affiliations

  • Centro de Ciências Computacionais, Federal University of Rio Grande, Rio Grande, Brazil

    José Rodrigo Azambuja

  • Instituto de Informatica, Federal University of Rio Grande do Sul, Porto Alegre, Brazil

    Fernanda Kastensmidt

  • Institut für Technik der Informationsver, Karlsruhe Institute of Technology, Karlsruhe, Germany

    Jürgen Becker

Bibliographic Information

  • Book Title: Hybrid Fault Tolerance Techniques to Detect Transient Faults in Embedded Processors

  • Authors: José Rodrigo Azambuja, Fernanda Kastensmidt, Jürgen Becker

  • DOI: https://doi.org/10.1007/978-3-319-06340-9

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer International Publishing Switzerland 2014

  • Hardcover ISBN: 978-3-319-06339-3Published: 28 July 2014

  • Softcover ISBN: 978-3-319-35997-7Published: 10 September 2016

  • eBook ISBN: 978-3-319-06340-9Published: 07 July 2014

  • Edition Number: 1

  • Number of Pages: XVIII, 94

  • Number of Illustrations: 26 b/w illustrations, 11 illustrations in colour

  • Topics: Circuits and Systems, Electronic Circuits and Devices, Electronics and Microelectronics, Instrumentation

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