Overview
- Introduces novel memories, using new materials and processing techniques, offering many advantages over dynamic memories such as traditional SRAM and e-DRAM
- Describes 3D integration of integrated circuits, enabling stacking of layers and shrinking device to device distance over traditional packages
- Enables readers to use on-chip integrated optics for interconnect
- Includes coverage of technology, design, and design automation
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Table of contents (8 chapters)
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Front Matter
Keywords
About this book
This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
Editors and Affiliations
About the editor
Bibliographic Information
Book Title: More than Moore Technologies for Next Generation Computer Design
Editors: Rasit O. Topaloglu
DOI: https://doi.org/10.1007/978-1-4939-2163-8
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media New York 2015
Hardcover ISBN: 978-1-4939-2162-1
Softcover ISBN: 978-1-4939-4710-2
eBook ISBN: 978-1-4939-2163-8
Edition Number: 1
Number of Pages: IX, 218
Number of Illustrations: 53 b/w illustrations, 63 illustrations in colour
Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Processor Architectures