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  • © 2015

Multi-Net Optimization of VLSI Interconnect

  • Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization
  • Presents research results that provide a level of design optimization which does not exist in commercially-available design automation software tools
  • Includes mathematical properties and conditions for optimality of layout, describes and analyses algorithmic solutions, and supplements analysis with examples taken from state-of-the-art chips
  • Includes supplementary material: sn.pub/extras

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Table of contents (10 chapters)

  1. Front Matter

    Pages i-xvi
  2. An Overview of the VLSI Interconnect Problem

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 1-9
  3. Interconnect Aspects in Design Methodology and EDA Tools

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 11-16
  4. Scaling Dependent Electrical Modeling of Interconnects

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 17-34
  5. Frameworks for Interconnect Optimization

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 35-42
  6. Net-by-Net Wire Optimization

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 43-61
  7. Multi-net Sizing and Spacing of Bundle Wires

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 63-106
  8. Multi-net Sizing and Spacing in General Layouts

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 107-165
  9. Interconnect Optimization by Net Ordering

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 167-194
  10. Layout Migration

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 195-219
  11. Future Directions in Interconnect Optimization

    • Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer
    Pages 221-222
  12. Back Matter

    Pages 223-233

About this book

This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.

Authors and Affiliations

  • Intel, Haifa, Israel

    Konstantin Moiseev

  • Technion, Haifa, Israel

    Avinoam Kolodny

  • Bar-Ilan University, Ramat-Gan, Israel

    Shmuel Wimer

About the authors

Konstantin Moiseev received the B.Sc., M.Sc. in Computer Engineering and Ph.D. in Electrical Engineering from the Technion – Israel Institute of Technology, Haifa, Israel in 2001, 2006 and 2011, respectively. Since 2006 he has been working with Intel Israel Design Center, Haifa, Israel. His general interests include computer-aided design systems, combinatorial optimization, heursitic methods, VLSI system design and interconnect design.

Avinoam Kolodny is an associate professor of electrical engineering at Technion –Israel Institute of Technology. He joined Intel after completing his doctorate in microelectronics at the Technion in 1980. During twenty years with the company he was engaged in diverse areas including non-volatile memory device physics, electronic design automation and organizational development.  He pioneered static timing analysis of processors, served as Intel’s corporate CAD system architect at the introduction of logic synthesis, and was manager of Intel’s performance verification CAD group in Israel. He has been a member of the Faculty of Electrical Engineering at the Technion since 2000. His current research is focused primarily on interconnect issues in VLSI systems, covering all levels from physical design of wires to networks on chip and multi-core system architecture.

Shmuel Wimer received the B.Sc. and M.Sc. degrees in mathematics from Tel-Aviv University, Tel-Aviv, Israel, and the D.Sc. degree in electrical engineering from the Technion-Israel Institute of Technology, Haifa, Israel, in 1978, 1981 and 1988, respectively. He worked for thirty two years at industry in R&D, engineering and managerial positions. From 1999 to 2009 he was with Intel Design Center in Haifa Israel, where he was responsible for the development, implementation and execution of Intel's microprocessors physical layout design migration (aka Tick-Tock). Prior to that, he worked for IBM, National Semiconductor and Israeli AerospaceIndustry (IAI). He is presently an Associate Professor with the Engineering Faculty of Bar-Ilan University, and an Associate Visiting Professor with the Electrical Engineering Faculty, Technion. He is interested in VLSI circuits and systems design optimization and combinatorial optimization.

Bibliographic Information

  • Book Title: Multi-Net Optimization of VLSI Interconnect

  • Authors: Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer

  • DOI: https://doi.org/10.1007/978-1-4614-0821-5

  • Publisher: Springer New York, NY

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Science+Business Media New York 2015

  • Hardcover ISBN: 978-1-4614-0820-8

  • Softcover ISBN: 978-1-4939-4262-6

  • eBook ISBN: 978-1-4614-0821-5

  • Edition Number: 1

  • Number of Pages: XVI, 233

  • Number of Illustrations: 80 b/w illustrations, 44 illustrations in colour

  • Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Processor Architectures

Buy it now

Buying options

eBook USD 79.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 99.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access