Logo - springer
Slogan - springer

Engineering - Circuits & Systems | Implantable Microtechnologies for the Brain - Packaging and Interconnects

Implantable Microtechnologies for the Brain

Packaging and Interconnects

Muthuswamy, Jit (Ed.)

2015, 200 p. 75 illus.

Available Formats:
eBook
Information

Springer eBooks may be purchased by end-customers only and are sold without copy protection (DRM free). Instead, all eBooks include personalized watermarks. This means you can read the Springer eBooks across numerous devices such as Laptops, eReaders, and tablets.

You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal.

After the purchase you can directly download the eBook file or read it online in our Springer eBook Reader. Furthermore your eBook will be stored in your MySpringer account. So you can always re-download your eBooks.

 

ISBN 978-1-4419-8520-0

digitally watermarked, no DRM

The eBook version of this title will be available soon


learn more about Springer eBooks

add to marked items

Hardcover
Information

Hardcover version

You can pay for Springer Books with Visa, Mastercard, American Express or Paypal.

Standard shipping is free of charge for individual customers.

 
approx. $129.00

(net) price for USA

ISBN 978-1-4419-8519-4

free shipping for individuals worldwide

Due: July 23, 2015


add to marked items

  • About this book

  • Describes a variety of problems confronting any designer of implantable microelectronic devices for the brain
  • Avoids discipline-specific, technical jargon in order to appeal to a multi-disciplinary audience
  • Includes a focused exploration of the brain-material interface problem, as well as the surgical and skull-mounting issues that impact the choice and success of packaging and interconnect technologies

This book describes the specific packaging and interconnect challenges involved in developing implantable microelectronic and MEMS devices for the brain and will explain a variety of the currently successful approaches. Significant, open problems will also be described, such as development of advanced materials, testing methodologies, and sensing and actuation technologies.

Content Level » Research

Keywords » Biomedical Microdevices - Embedded Systems - Implantable Microtechnologies - Integrated Circuits and Systems - MEMS Packaging and Interconnect - Neural Prostheses

Related subjects » Biomaterials - Biomedical Engineering - Circuits & Systems - Engineering

Table of contents 

Introduction.- Interconnect technologies.- Encapsulation technologies.- Testing and validation.- Emerging technologies and packaging challenges.

Popular Content within this publication 

 

Articles

Services for this book

New Book Alert

Get alerted on new Springer publications in the subject area of Circuits and Systems.