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Describes a variety of problems confronting any designer of implantable microelectronic devices for the brain
Avoids discipline-specific, technical jargon in order to appeal to a multi-disciplinary audience
Includes a focused exploration of the brain-material interface problem, as well as the surgical and skull-mounting issues that impact the choice and success of packaging and interconnect technologies
This book describes the specific packaging and interconnect challenges involved in developing implantable microelectronic and MEMS devices for the brain and will explain a variety of the currently successful approaches. Significant, open problems will also be described, such as development of advanced materials, testing methodologies, and sensing and actuation technologies.
Content Level »Research
Keywords »Biomedical Microdevices - Embedded Systems - Implantable Microtechnologies - Integrated Circuits and Systems - MEMS Packaging and Interconnect - Neural Prostheses