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Interconnects in VLSI Design

  • Book
  • © 2000

Overview

Editors:
  1. Hartmut Grabinski

    1. Universität Hannover, Germany

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Table of contents (18 chapters)

  1. Front Matter

    Pages i-vii
    Download chapter PDF

  2. Recent Development in Interconnect Modeling

    • J. M. Wang, E. S. Kuh
    Pages 1-23

  3. Study of Parallel Plane Mode Excitation at a Double-Layer via Interconnect using the FDTD Method

    • C. Schuster, W. Fichtner
    Pages 25-35

  4. A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology

    • Thomas Steinecke
    Pages 37-48

  5. Measurement of Signal Integrity within Deep Sub-Micron Interconnect

    • F. Caignet, S. Delmas-Ben-dhia, E. Sicard
    Pages 49-59

  6. Considering Magnetic Interference in Board-Level Interconnect Design

    • Georg Müller, Karl Reiß
    Pages 61-69

  7. Input Shape Influence over Interconnect Performances

    • L. B. Kenmei, F. Huret, E. Paleczny, P. Kennis, G. Servel, D. Deschacht
    Pages 71-77

  8. Comparisons of RL and RLC Interconnect Models in the Simultaneous Switching Noise Simulations

    • S. Hasan, J. Prince, A. Cangellaris
    Pages 79-88

  9. Black-Box Modeling of Digital Devices

    • I. S. Stievano, I. A. Maio, F. G. Canavero
    Pages 89-100

  10. Advanced Modeling of Nonuniform Interconnects

    • S. Grivet-Talocia, F. G. Canavero
    Pages 101-117

  11. Modeling of Passive Components for Radio Frequency Applications

    • J. Lescot, J. Haidar, A. Giry, F. Ndagijimana
    Pages 119-131

  12. Electrical Performance of Capacitors Integrated in Multi-Layered Printed Circuit Boards

    • An Madou, Luc Martens
    Pages 133-145

  13. Characteristic Impedance Measurement on Silicon

    • U. Arz, D. F. Williams, H. Grabinski
    Pages 147-154

  14. Efficient Computation of the Parameters of Parallel Transmission Lines in IC Interconnects

    • M. Grimm, H. K. Dirks
    Pages 155-179

  15. Modeling of Optical Interconnections for Data Transmission within High-Speed Electronic Systems

    • Amir Wallrabenstein, Thomas Bierhoff, Andreas Himmler, Elmar Griese, Gerd Mrozynski
    Pages 181-194

  16. Quantifying the Performance of Optoelectronic FPGA’s: The Impact of Optical Interconnect Latency

    • J. Dambre, H. Van Marck, J. Van Campenhout
    Pages 195-202

  17. PIN CMOS Receivers for Optical Interconnects

    • H. Zimmermann, T. Heide, A. Ghazi, P. Seegebrecht
    Pages 203-212

  18. BiCMOS Receiver OEIC for Optical Interconnects

    • K. Kieschnick, H. Zimmermann, H. Pleß, P. Seegebrecht
    Pages 213-220

  19. Electrical-Optical Printed Circuit Boards: Technology - Design - Modeling

    • Elmar Griese, Detlef Krabe, Engelbert Strake
    Pages 221-236
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Keywords

About this book

This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua­ tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des­ cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.

Editors and Affiliations

  • Universität Hannover, Germany

    Hartmut Grabinski

Bibliographic Information

  • Book Title: Interconnects in VLSI Design

  • Editors: Hartmut Grabinski

  • DOI: https://doi.org/10.1007/978-1-4615-4349-7

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media Dordrecht 2000

  • Hardcover ISBN: 978-0-7923-7997-3Published: 31 October 2000

  • Softcover ISBN: 978-1-4613-6954-7Published: 08 October 2012

  • eBook ISBN: 978-1-4615-4349-7Published: 06 December 2012

  • Edition Number: 1

  • Number of Pages: VII, 236

  • Topics: Circuits and Systems, Electrical Engineering, Computer-Aided Engineering (CAD, CAE) and Design

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