Overview
- Compares and contrasts lead-free soldering techniques and electrically conductive adhesives and discusses the advantages of electrically conductive adhesives
- Discusses isotropically conductive adhesives, anisotropically conductive adhesives/films, non-conductrice adhesives/films, their current applications, in industry, advantages and limitations, recent developments and nanotechnology applications
- Provides insight into the future of nano electrically conductive adhesives and industry trends
- Includes supplementary material: sn.pub/extras
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Table of contents (9 chapters)
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Front Matter
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Back Matter
Keywords
About this book
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Reviews
From the reviews:
“This book is a review of the most recent advances in various types of electrically conductive adhesives, with a focus on emerging nanotechnology, including materials development and characterizations … . Our readers who are materials scientists and materials engineers who develop electrically conductive adhesives and conductive polymers for microelectronics applications would definitely find this book very interesting. It is an excellent resource of current ECA materials, processes, and technology … . This is truly a worthwhile reference book to own for those develop ECAs.” (Electrical Insulation Magazine, Vol. 27 (2), March/April, 2011)Authors and Affiliations
Bibliographic Information
Book Title: Electrical Conductive Adhesives with Nanotechnologies
Authors: Yi Li, Daniel Lu, C. P. Wong
DOI: https://doi.org/10.1007/978-0-387-88783-8
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2010
Hardcover ISBN: 978-0-387-88782-1Published: 16 October 2009
Softcover ISBN: 978-1-4899-8307-7Published: 05 September 2014
eBook ISBN: 978-0-387-88783-8Published: 08 October 2009
Edition Number: 1
Number of Pages: XII, 437
Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Nanotechnology, Optical and Electronic Materials, Materials Science, general