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Describes packaging design for high power semiconductor lasers
Details prevention techniques for thermal stress failures
Discusses most recent technology trends in semiconductor laser packaging
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
Content Level »Research
Keywords »Fiber Lasers - High Power Semiconductor Lasers - Semiconductor Laser Components - Semiconductor Laser Packaging - Semiconductor Lasers - Solid State Lasers - Thermal Stress Modeling
Introduction of High Power Semiconductor Lasers.- Package Types of High Power Semiconductor Lasers.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress Failures: Prediction and Prevention.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Processes in Packaging of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Reliability Assessment and Failure Analysis in High Power Semiconductor Lasers.- Technology Trend and Challenges in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.
Distribution rights for India: Delhi Book Store, New Delhi, India