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Chemistry - Inorganic Chemistry | Plasma Chemistry and Plasma Processing – incl. option to publish open access (Editorial Board)

Plasma Chemistry and Plasma Processing

Plasma Chemistry and Plasma Processing

Editor-in-Chief: S. Veprek; A. Murphy

ISSN: 0272-4324 (print version)
ISSN: 1572-8986 (electronic version)

Journal no. 11090

Editors:

Stan Veprek
Department of Chemistry, Technical University of Munich, Lichtenbergstr. 4
D-85747 Garching, Germany

Anthony B. Murphy
CSIRO Manufacturing Flagship 
Lindfield, Australia

Founding Editor:

Emil Pfender
Department of Mechanical Engineering, University of Minnesota
Minneapolis, Minnesota

Editorial Board:

J. P. Badyal, University of Durham, Durham, England; M. Boulos, University of Sherbrooke, QC, Canada; Jean-Louis Brisset, Paris, France; P. Bruggeman, University of Minnesota, Minnesota, USA; M. Capitelli, University of Bari, Bari, Italy; P. Fauchais, University of Limoges, France; E. Fisher, Colorado State University, Fort Collins, Colorado; S. Girshick, University of Minnesota, Minnesota, USA; D.B. Graves, University of California, Berkeley; D. Hegemann, Empa, Swiss Federal Laboratories for Materials Science and Technology, St.Gallen, Switzerland; Ch. Hollenstein, Swiss Federal Institute of Technology, Lausanne, Switzerland; M. Hrabovsky, Academy of Sciences of the Czech Republic, Prague, Czech Republic; U. Kogelschatz, Haussen bei Brugg, Switzerland; Michael Kong, Old Dominion University, Norfolk, Virginia; B. R. Locke, Florida State University and Florida A & M University, Tallahassee, Florida; D. Loffhagen, Institute of Low-Temperature Plasma Physics, Greifswald, Germany; Rino Morent , Ghent University, Belgium; J. Mostaghimi, University of Toronto, CanadaT. Nozaki, Tokyo Institute of Technology, Tokyo, Japan; K. Tachibana, Osaka Electro-Communication University, Osaka, Japan; A. Vardelle, Universite de Limoges, Limoges, France; J. C. Whitehead, University of Manchester, Manchester, England.

 

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    Plasma Chemistry and Plasma Processing is an international journal that provides a forum for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The journal encompasses all types of industrial processing plasmas, ranging from nonthermal plasmas to thermal plasmas, and publishes fundamental plasma studies as well as studies of specific plasma applications. Application contexts of interest include plasma etching in microelectronics and other fields, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and others. Papers are particularly encouraged that report studies of chemical kinetics in plasmas, or the interactions of plasmas with surfaces.

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