Kondo, K., Akolkar, R.N., Barkey, D.P., Yokoi, M. (Eds.)
2014, VIII, 282 p. 190 illus., 75 illus. in color.
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Focuses on wide range of microelectronics application
Describes scientific mechanism of copper electrodeposition
Modern and basic knowledge about nanotechnology
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as:
• ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes
This book is ideal for nanotechnologists, industry professionals, and practitioners.