Overview
- The multidisciplinarity of this book makes it an especially valuable tool for those interested in ULSI Interconnects
- Includes supplementary material: sn.pub/extras
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Table of contents (35 chapters)
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Introduction
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Interconnect Materials
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Deposition Processes for ULSI Interconnects
Keywords
About this book
Editors and Affiliations
Bibliographic Information
Book Title: Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Editors: Yosi Shacham-Diamand, Tetsuya Osaka , Madhav Datta, Takayuki Ohba
DOI: https://doi.org/10.1007/978-0-387-95868-2
Publisher: Springer New York, NY
eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)
Copyright Information: Springer-Verlag New York 2009
Hardcover ISBN: 978-0-387-95867-5
Softcover ISBN: 978-1-4614-9744-8
eBook ISBN: 978-0-387-95868-2
Edition Number: 1
Number of Pages: XX, 552
Topics: Electrochemistry, Materials Science, general, Industrial Chemistry/Chemical Engineering, Electrical Engineering, Nanotechnology