Overview
- Emphasizes interrelated diffusion along multiple path, microstructure, micro-chemistry fields of all kinds, particularly of the interfaces
- Contains an entire chapter devoted to computer simulations of diffusion at the atomic level
- Treats high temperature applications
- Treats metal diffusion in polymers and on polymer surfaces
- Treats electromigration in copper thin films
- Treats newly discovered high temperature super conducting cuprates and some piezoelectric ceramics
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Table of contents(10 chapters)
About this book
Editors and Affiliations
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IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights
Devendra Gupta
Bibliographic Information
Book Title: Diffusion Processes in Advanced Technological Materials
Editors: Devendra Gupta
DOI: https://doi.org/10.1007/978-3-540-27470-4
Publisher: Springer Berlin, Heidelberg
eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)
Copyright Information: Springer-Verlag Berlin Heidelberg 2005
Hardcover ISBN: 978-3-540-21938-5Published: 17 March 2005
Softcover ISBN: 978-3-642-06019-9Published: 02 January 2013
eBook ISBN: 978-3-540-27470-4Published: 01 June 2010
Edition Number: 1
Number of Pages: XVIII, 532
Additional Information: Jointly published with William Andrew, Norwich, NY, USA
Topics: Tribology, Corrosion and Coatings, Physical Chemistry, Characterization and Evaluation of Materials, Condensed Matter Physics, Electronics and Microelectronics, Instrumentation