Wafer Bonding

1. Front Matter

   Pages I-XV

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2. Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding

   • J. Haisma

   Pages 1-60

3. Basics of Silicon-on-Insulator (SOI) Technology

   • J.-P. Colinge

   Pages 61-83

4. Silicon-on-insulator by the Smart Cut™ Process

   • G. K. Celler, A. J. Auberton-Hervé, B. Aspar, C. Lagahe-Blanchard, C. Maleville

   Pages 85-105

5. ELTRAN® Technology Based on Wafer Bonding and Porous Silicon

   • K. Sakaguchi, T. Yonehara

   Pages 107-156

6. Wafer Bonding for High-Performance Logic Applications

   • K. W. Guarini, H.-S. P. Wong

   Pages 157-191

7. Application of Bonded Wafers to the Fabrication of Electronic Devices

   • A. W. Nevin

   Pages 193-261

8. Compound Semiconductor Heterostructures by Smart Cut™: SiC On Insulator, QUASIC™ Substrates, InP and GaAs Heterostructures on Silicon

   • L. Di Cioccio, E. Jalaguier, F. Letertre

   Pages 263-314

9. Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach

   • S. Noda

   Pages 315-326

10. Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers

    • A. Plößl

    Pages 327-357

11. High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits

    • E. D. Kyriakis-Bitzaros, G. Halkias

    Pages 359-376

12. Layer Transfer by Bonding and Laser Lift-Off

    • T. D. Sands, W. S. Wong, N. W. Cheung

    Pages 377-415

13. Single-Crystal Lithium Niobate Films by Crystal Ion Slicing

    • M. Levy, A. M. Radojevic

    Pages 417-450

14. Wafer Bonding of Ferroelectric Materials

    • M. Alexe, I. Radu, I. Szafraniak

    Pages 451-471

15. Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications

    • J. Bagdahn, M. Petzold

    Pages 473-494

16. Back Matter

    Pages 495-503

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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

• Compound semiconductors
• Diode
• Helium-Atom-Streuung
• MEMS
• Semiconductor
• Silicon-on-insulator
• Wafer
• Wafer bonding
• basics
• crystal
• integrated circuit
• logic
• optoelectronics
• semiconductors

From the reviews:

"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s … . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)

• Max-Planck Institute of Microstructure Physics, Halle (Saale), Germany

  Marin Alexe, Ulrich Gösele

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