Materials for Advanced Packaging

1. Front Matter

   Pages i-xvi

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2. 3D Integration Technologies: An Overview

   • Dingyou Zhang, James J.-Q. Lu

   Pages 1-26

3. Advanced Bonding/Joining Techniques

   • Chin C. Lee, Chu-Hsuan Sha, Yuan-Yun Wu, Shou-Jen Hsu

   Pages 27-90

4. Advanced Chip-to-Substrate Connections

   • Paul A. Kohl

   Pages 91-129

5. Advanced Wire Bonding Technology: Materials, Methods, and Testing

   • Harry K. Charles Jr.

   Pages 131-198

6. Lead-Free Soldering

   • Ning-Cheng Lee

   Pages 199-236

7. Thin Die Fabrication and Applications to Wafer Level System Integration

   • Doug C. H. Yu, Wen-Chih Chiou, Chih Hang Tung

   Pages 237-285

8. Advanced Substrates: A Materials and Processing Perspective

   • Bernd K. Appelt

   Pages 287-329

9. Flip-Chip Underfill: Materials, Process, and Reliability

   • Zhuqing Zhang, Pengli Zhu, C. P. Wong

   Pages 331-371

10. New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips

    • Hideaki Sasajima, Itaru Watanabe, Makoto Takamoto, Kazuhiko Dakede, Shingo Itoh, Yoshinori Nishitani et al.

    Pages 373-419

11. Electrically Conductive Adhesives (ECAs)

    • Daniel Lu, C. P. Wong

    Pages 421-468

12. Die Attach Adhesives and Films

    • Shinji Takeda, Takashi Masuko, Nozomu Takano, Teiichi Inada

    Pages 469-510

13. Thermal Interface Materials

    • Ravi Prasher, Chia-Pin Chiu

    Pages 511-535

14. Embedded Passives

    • Pulugurtha Markondeya Raj, Dok Won Lee, Liangliang Li, Shan Xiang Wang, Parthasarathi Chakraborti, Himani Sharma et al.

    Pages 537-588

15. Advanced Bonding Technology Based on Nano- and Micro-metal Pastes

    • Katsuaki Suganuma, Jinting Jiu

    Pages 589-626

16. Wafer Level Chip Scale Packaging

    • Michael Töpper

    Pages 627-695

17. Microelectromechanical Systems and Packaging

    • Y. C. Lee, Ming Kong, Yadong Zhang

    Pages 697-731

18. LED Die Bonding

    • Yu-Chou Shih, Gunwoo Kim, Jiun-Pyng You, Frank G. Shi

    Pages 733-766

19. Medical Electronics Design, Manufacturing, and Reliability

    • Mark Porter, Robert Erich, Mark Ricotta

    Pages 767-811

20. Flexible and Printed Electronics

    • I-Chun Cheng

    Pages 813-854

This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.

• Microelectronic packaging
• Adhesives and films
• Bonding and joining techniques
• Nanomaterials and nanopackaging
• Printed electronics
• MEMS packaging

• Henkel China Co., Ltd, Shanghai, China

  Daniel Lu

• Materials Science and Engineering, Georgia Institute of Technology, Atlanta, USA

  C.P. Wong

Dr. Daniel Lu is the Vice President of Technology, Henkel Corporation in Asia Pacific. Prior to joining Henkel, he worked for the R&D department of Intel Corp (Arizona, USA) as a Sr. Scientist for 7 years. He received his MS and PhD degrees on Polymer Science and Engineering from Georgia Institute of Technology in 1996 and 2000, respectively. Dr. Lu received many awards including the IEEE/CPMT Outstanding Young Engineer Award in 2004, the IEEE ECTC best poster paper in 2007, Intel’s most patent filing in 2003-2007, etc. Dr. Lu has published more than 50 journal papers, wrote chapters for six books, and holds more than 80 US and international patents. He is the editor of the book “Materials for Advanced Packaging (2008)” and co-author of the book “Electronically Conductive Adhesives with Nanotechnologies (2009)”. He has been serving key roles in organizing international electronic packaging conferences and teaching professional development courses in these conferences. Dr. Lu is a senior member of IEEE, and an associate editor of IEEE Transactions on Advanced Packaging and Journal of Nanomaterials, and an editorial board member of Nanoscience & Nanotechnology-Asia. Dr. Lu also serves as an adjunct professor in Huazhong University of Science and Technology, and SIAT (Shenzhen Institute of Advanced Technologies), Chinese Academy of Science. Dr. Lu has more 15 years of experience in electronic packaging and is an expert in electronic packaging materials and processing.



Professor C.P. Wong is with the School of Materials Sciences and Engineering at Georgia Tech (GT) and also is the Dean of Engineering, The Chinese University of Hong Kong. Prior to joining GT, he was with AT&T Bell Laboratories for many years and was an AT&T Bell Labs Fellow. His research interests focus on the areas of material and process for electronic, photonic, MEMS, sensors, and energy harvesting and storage. He has published over 1,000 technical papers, 12 books and holds over 65 US Patents. He is a member of the US National Academy of Engineering and a Foreign Academician of the Chinese Academy of Engineering.

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