Dielectric Breakdown in Gigascale Electronics

1. Front Matter

   Pages i-viii

   PDF

2. Introduction

   • Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky

   Pages 1-9

3. General Theories

   • Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky

   Pages 11-19

4. Measurement Tools and Test Structures

   • Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky

   Pages 21-26

5. Experimental Techniques

   • Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky

   Pages 27-36

6. Breakdown Experiments

   • Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky

   Pages 37-57

7. Kinetics of Charge Carrier Confinement in Thin Dielectrics

   • Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky

   Pages 59-75

8. Theory of Dielectric Breakdown in Nano-Porous Thin Films

   • Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky

   Pages 77-91

9. Dielectric Breakdown in Copper Interconnects

   • Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky

   Pages 93-98

10. Reconsidering Conventional Field Acceleration Models

    • Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky

    Pages 99-105

This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. Similarly, the models presented here will help to improve current methodologies for estimating the failure of gigascale electronics at device operating conditions from accelerated lab test conditions. Numerous graphs, tables, and illustrations are included to facilitate understanding of the topics.  Readers will be able to understand dielectric breakdown in thin films along with the main failure modes and characterization techniques. In addition, they will gain expertise on conventional as well as new field acceleration test models for predicting long term dielectric degradation.

• Chip Interconnects
• Dielectric Breakdown
• Interconnect Reliability Science
• Low-k Interconnect
• Metal Catalyzed Dielectric Failure
• Nanoporous Dielectrics
• Reliability of Gigascale Electronics
• Reliability of Modern Porous Low-k Films
• TDDB for Gigascale Electronic Devices
• TDDB in Modern Interconnects
• Time-dependent-dielectric-breakdown (TDDB)

• General Electric Global Research Center, Niskayuna, USA

  Juan Pablo Borja

• Department of Physics, Applied Physics, & Astronomy, Rensselaer Polytechnic Institute, Troy, USA

  Toh-Ming Lu

• Chemical and Biological Engineering, Rensselaer Polytechnic Institute, Troy, USA

  Joel Plawsky

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