Overview
- Focuses on wide range of microelectronics application
- Describes scientific mechanism of copper electrodeposition
- Modern and basic knowledge about nanotechnology
- Includes supplementary material: sn.pub/extras
Part of the book series: Nanostructure Science and Technology (NST, volume 171)
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Table of contents (12 chapters)
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Front Matter
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Copper Electrodepositon and Additive Chemistry
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Front Matter
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Copper on Chip Metallization
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Front Matter
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Through Silicon Via and Other Methods
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Front Matter
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Keywords
About this book
Editors and Affiliations
About the editors
Kazuo Kondo is Professor at the Department of Chemical engineering, Osaka Prefecture University. He has over 200 research publications and 100 patents. His major areas of research are copper electrodeposition for nano fabrication, electrodeposition, batteries, and CVD.
Dale Barkey is a Professor of Chemical Engineering at the University of New Hampshire where he joined the faculty in 1987. His research in Electrochemical Engineering has addressed Pattern Formation, Electrodeposition, Anodizing and Corrosion Processes. His work has appeared in The Journal of the Electrochemical Society, Physical Review, The American Concrete Institute Materials Journal and Plating and Surface Finishing.
Rohan Akolkar is an Associate Professor of Chemical Engineering at Case Western Reserve University (CWRU) in Cleveland, OH. His research focuses on fundamental electrochemistry and electrochemical engineering. His work on electrodeposition has appeared in the Journal of the Electrochemical Society and the Journal of Power Sources. In 2004, he was received the Norman Hackerman Prize by the Electrochemical Society.
Masayuki Yokoi is the Chief Technical Consultant at the Industrial Technology Support Institute of Higashioska City, Osaka Prefecture, Japan.
Bibliographic Information
Book Title: Copper Electrodeposition for Nanofabrication of Electronics Devices
Editors: Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi
Series Title: Nanostructure Science and Technology
DOI: https://doi.org/10.1007/978-1-4614-9176-7
Publisher: Springer New York, NY
eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)
Copyright Information: Springer Science+Business Media New York 2014
Hardcover ISBN: 978-1-4614-9175-0Published: 21 November 2013
Softcover ISBN: 978-1-4939-5373-8Published: 23 August 2016
eBook ISBN: 978-1-4614-9176-7Published: 20 November 2013
Series ISSN: 1571-5744
Series E-ISSN: 2197-7976
Edition Number: 1
Number of Pages: VIII, 282
Number of Illustrations: 115 b/w illustrations, 75 illustrations in colour
Topics: Electrochemistry, Nanotechnology, Electronics and Microelectronics, Instrumentation, Solid State Physics