Authors:
- Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management
- Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials
- Covers system and component integration of advanced packaging materials
- Includes supplementary material: sn.pub/extras
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Table of contents (10 chapters)
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Front Matter
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Back Matter
About this book
Authors and Affiliations
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, College of Materials Science and Eng., Central South University, Changsha, China, People's Republic
Guosheng Jiang
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Brewer Science, Springfield, USA
Liyong Diao
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Torrey Hills Technologies, LLC, San Diego, USA
Ken Kuang
Bibliographic Information
Book Title: Advanced Thermal Management Materials
Authors: Guosheng Jiang, Liyong Diao, Ken Kuang
DOI: https://doi.org/10.1007/978-1-4614-1963-1
Publisher: Springer New York, NY
eBook Packages: Energy, Energy (R0)
Copyright Information: Springer Science+Business Media New York 2013
Hardcover ISBN: 978-1-4614-1962-4
Softcover ISBN: 978-1-4899-9254-3
eBook ISBN: 978-1-4614-1963-1
Edition Number: 1
Number of Pages: XII, 156
Topics: Energy Efficiency, Electronics and Microelectronics, Instrumentation, Engineering Thermodynamics, Heat and Mass Transfer, Metallic Materials