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Substrate Noise Coupling in RFICs

  • Book
  • © 2008

Overview

Authors:
  1. Ahmed Helmy

    1. Dept. Electrical&Computer Engineering, Ohio State University, Columbus OH 43210, USA

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    You can also search for this author in PubMed   Google Scholar

  2. Mohammed Ismail

    1. Dept. Electrical&Computer Engineering Analog VLSI Lab, The Ohio State University, Columbus OH 43210, USA

    View author publications

    You can also search for this author in PubMed   Google Scholar

  • Addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip(SoC) containing digital ICs as well
  • Great reference for courses in RFIC and mixed signal ICs, and for design project courses
  • Reports silicon measurements, new test and noise isolation structures as well as calibration of a design flow used in the design and debug phases of RFIC circuits
  • The first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC

Part of the book series: Analog Circuits and Signal Processing (ACSP)

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Table of contents (7 chapters)

  1. Front Matter

    Pages I-XIV
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  2. Introduction

    • Ahmed Helmy, Mohammed Ismail
    Pages 1-5

  3. Analysis of Substrate Noise Coupling

    • Ahmed Helmy, Mohammed Ismail
    Pages 7-24

  4. Experimental Data to Calibrate the Design Flow

    • Ahmed Helmy, Mohammed Ismail
    Pages 25-42

  5. Design Guide for Substrate Noise Isolation in RF Applications

    • Ahmed Helmy, Mohammed Ismail
    Pages 43-62

  6. On Chip Inductors Design Flow

    • Ahmed Helmy, Mohammed Ismail
    Pages 63-86

  7. Case Studies for the Impacts and Remedies of Substrate Noise Coupling

    • Ahmed Helmy, Mohammed Ismail
    Pages 87-104

  8. Conclusion and Future Work

    • Ahmed Helmy, Mohammed Ismail
    Pages 105-112

  9. Back Matter

    Pages 113-120
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Keywords

About this book

Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful “system on chip” ?rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ?ow is built, calibrated to silicon and used as part of the design and validation ?ows to uncover and ?x substrate coupling problems in RF ICs. The ?ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the ?oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling.

Authors and Affiliations

  • Dept. Electrical&Computer Engineering, Ohio State University, Columbus OH 43210, USA

    Ahmed Helmy

  • Dept. Electrical&Computer Engineering Analog VLSI Lab, The Ohio State University, Columbus OH 43210, USA

    Mohammed Ismail

About the authors

Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series

Bibliographic Information

  • Book Title: Substrate Noise Coupling in RFICs

  • Authors: Ahmed Helmy, Mohammed Ismail

  • Series Title: Analog Circuits and Signal Processing

  • DOI: https://doi.org/10.1007/978-1-4020-8166-8

  • Publisher: Springer Dordrecht

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Science+Business Media B.V. 2008

  • Hardcover ISBN: 978-1-4020-8165-1Published: 08 April 2008

  • Softcover ISBN: 978-90-481-7789-9Published: 25 November 2010

  • eBook ISBN: 978-1-4020-8166-8Published: 23 March 2008

  • Series ISSN: 1872-082X

  • Series E-ISSN: 2197-1854

  • Edition Number: 1

  • Number of Pages: XV, 119

  • Topics: Circuits and Systems, Communications Engineering, Networks

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