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Advanced Wirebond Interconnection Technology

  • Book
  • © 2004

Overview

Authors:
  1. Shankara K. Prasad

    1. INKROMA, Bangalore, India

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Table of contents (7 chapters)

  1. Front Matter

    Pages i-xxix
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  2. Introduction

    Pages 1-16

  3. Materials for Wire Bonding

    Pages 17-93

  4. Bonding Equipment

    Pages 95-162

  5. Process Technology

    Pages 163-480

  6. Quality

    Pages 481-557

  7. Reliability

    Pages 559-628

  8. New Technologies and New Applications for Wire Bonding

    Pages 629-653

  9. Back Matter

    Pages 655-669
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Keywords

About this book

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

Authors and Affiliations

  • INKROMA, Bangalore, India

    Shankara K. Prasad

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