Overview
- Editors:
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Francis E. H. Tay
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The National University of Singapore, Singapore
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Table of contents (14 chapters)
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Front Matter
Pages N3-xix
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- Paul Muralt, Nicolas Ledermann, Jacek J. Baborowski, Sandrine Gentil
Pages 1-24
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- A. Prochaska, S. J. N. Mitchell, H. S. Gamble
Pages 25-50
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- T. Lalinsky, M. Drzik, L. Matay, I. Kostic, Z. Mozolova, S. Hascik et al.
Pages 51-75
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- T. L. Tan, V. A. Kudryashov, B. L. Tan
Pages 97-111
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- Francis E. H. Tay, S. J. O’Shea, Andrew T. S. Wee, Poh Chong Lim, Andojo Ongkodjojo
Pages 113-132
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- K. N. Bhat, N. DasGupta, A. DasGupta, P. R. S. Rao, R. Navin Kumar, Y. Chandana
Pages 133-156
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- J. T. Sheu, H. T. Chou, W. L. Cheng, C. H. Wu, L. S. Yeou
Pages 157-174
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- Dong-il Dan Cho, Jongpal Kim, Setae Kim, Sangjun Park, Seung-Joon Paik, Chiwan Ku et al.
Pages 175-184
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- Vladimir Kudryashov, Paul Lee
Pages 185-202
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- Arief Budiman Suriadi, Vineet Sharma, Bernhard Wieder, Gerald Mittendorfer
Pages 203-229
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- Hong Zhu, Jianmin Miao, Minoru Noda, Huaping Xu, Masanori Okuyama
Pages 231-256
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- Dong-il Dan Cho, Sangjun Park, Jongpal Kim, Sangchul Lee, Sang Woo Lee
Pages 257-272
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- Won Jong Yoo, Kitt Wai Kok, Say Yong Koh
Pages 273-294
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Back Matter
Pages 295-299
About this book
The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J.
Editors and Affiliations
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The National University of Singapore, Singapore
Francis E. H. Tay
