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Mechanics of Solder Alloy Interconnects

  • Book
  • © 1994

Overview

Authors:
  1. Darrel R. Frear
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  2. Steven N. Burchett
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  3. Harold S. Morgan
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  4. John H. Lau
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About this book

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Bibliographic Information

  • Book Title: Mechanics of Solder Alloy Interconnects

  • Authors: Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau

  • Publisher: Springer New York, NY

  • Copyright Information: Springer-Verlag US 1994

  • Hardcover ISBN: 978-0-442-01505-3Published: 31 January 1994

  • Edition Number: 1

  • Number of Pages: XIV, 418

  • Topics: Control Structures and Microprogramming, Manufacturing, Machines, Tools, Processes

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